IBM and AIM Photonics, an institute of Manufacturing USA, announced a patent and intellectual property licensing agreement and confirmed IBM has joined the AIM Photonics consortium which seeks to advance integrated photonic circuit manufacturing and technology development.
Industry and academic AIM Photonics members will access technologies through a process design kit (PDK) and prototype development at the Rochester Test Assembly and Packaging (TAP) facility and the 300mm chip facility at SUNY Poly’s Albany campus.
“Adding IBM as a member of AIM Photonics not only significantly strengthens this outstanding institute, but highlights the momentum the Finger Lakes region is experiencing in the high tech sector,” said John Maggiore, New York State photonics board of officers chairman.
“This announcement further validates the importance of this institute and the goals it has set out to achieve.”
Through its membership, IBM will contribute to the development of AIM Photonics’ advanced integrated silicon photonics technology, packaging services, and other future offerings to make advanced technology available to AIM Photonics members and the wider technical community.
AIM Photonics is part of the Finger Lakes Forward revitalization effort — the region’s strategic plan for economic growth, which places an emphasis on the industry cluster of optics, photonics and imaging to realize the region’s potential.